Google Pixel 11 Series Leaked: Tensor G6 Details, New Camera Hardware, and Design Changes Revealed
Key Takeaways
- ▸Tensor G6 marks Google's strategic shift from Samsung Exynos modems to MediaTek's M90 modem, signaling a significant change in supplier strategy
- ▸New camera sensors ("chemosh," "bastet," "barghest") demonstrate Google's continued focus on computational photography improvements and hardware differentiation
- ▸"Pixel Glow" replaces the temperature sensor, bringing a design-forward approach similar to Nothing's Glyph interface with a focus on visual feedback
Summary
A comprehensive leak of Google's upcoming Pixel 11 series has revealed extensive details about the chipset, hardware upgrades, and design changes. The leak includes specifications for the Tensor G6 processor, which will feature a 1+4+2 configuration with newer ARM C1 cores, PowerVR C-Series GPU, an updated Titan M3 security chip, and notably, a MediaTek M90 modem—marking Google's departure from Samsung Exynos modems used for years. Additionally, Google has designed a new TPU and GXP image signal processor (ISP) for the series.
The Pixel 11 lineup will receive notable camera hardware upgrades, with the base model and Pixel 11 Pro Fold receiving a new 50MP "chemosh" sensor, while the Pixel 11 Pro and Pro XL will get new "bastet" and "barghest" sensors for their main and telephoto lenses. The leak reveals standard specifications like display resolutions ranging from 1080×2424 to 1344×2992 pixels, battery capacities between 4,658-5,000 mAh for various models, and a new design feature called "Pixel Glow"—illuminated LEDs on the camera bar similar to Nothing's Glyph interface.
The leak indicates that the temperature sensor on Pro models will be removed, replaced by the Pixel Glow feature on the camera bar. Notably, Google's "Project Toscana" face unlock hardware will not debut in the Pixel 11 series. The overall design is expected to remain similar to the Pixel 10 series, with the Pixel 11 series anticipated to launch in August 2026.
- Multiple display and battery improvements across the lineup, with the Pixel 11 Pro Fold introducing a 12GB RAM option for the first time
Editorial Opinion
The Pixel 11 leak reveals Google's commitment to meaningful hardware upgrades rather than incremental improvements, particularly with new camera sensors and the strategic modem transition. The introduction of "Pixel Glow" signals a design philosophy shift that prioritizes visual appeal and functionality over wellness features—a smart bet given that temperature sensing has seen limited consumer adoption. The Tensor G6's architecture improvements and new computational imaging hardware suggest Google believes it can compete on AI-driven camera performance rather than relying on raw sensor megapixels. However, the absence of Project Toscana face unlock and the removal of the temperature sensor represent trade-offs that may disappoint users expecting feature parity across generations.
